Thursday 9 May 2019 | The Silverstone Wing, Silverstone Circuit | Northamptonshire

Seminar Programme 2019

Time Information
9:30 AM - 10:10 AM
Why thermal simulation is a must for electronics design?
Tom Gregory, Product Manager , 6SigmaET from Future Facilities

There are so many things to consider when designing a PCB, from signal integrity to Design for manufacture. Thermal management can often get forgotten about and left to the last minute.

In this workshop you will learn how to use thermal simulation to identify thermal issues early in the design process. You will discover how to import PCB designs from your EDA software in to a 6SigmaET thermal simulation, how to accurately model components on your board and how to use simulation results to improve a systems thermal management. Using simulation helps you eliminate thermal issues and streamline your design process. 

5 THINGS THE DELEGATES WILL LEARN DURING THIS SESSION:

1.    How thermal simulation help identify and resolve thermal issues in electronics
2.    How to create thermal simulation from concept to final design
3.    How heat transfer through a PCB
4.    How to Import PCB designs from your EDA software into a 6SigmaET thermal simulation
5.    How to accurately model electronic components in a thermal simulation
10:30 AM - 11:10 AM
The benefits of flexible printed circuits as a replacement for wire harnesses
Philip Johnston, CEO, Trackwise Designs

Philip Johnston, CEO, Trackwise will give an overview of flexible printed circuit (FPC) technologies and applications and introduce Trackwise’s patented Improved Harness Technology™ (IHT). He will outline the benefits of FPCs over wire harnesses and emphasise the new application opportunities presented by multilayer FPCs of unlimited length.

DURING THIS SESSION DELEGATES WILL LEARN:
  1. How an FPC has multiple benefits as a replacement to wire harness.
  2. How Improved Harness Technology™ (IHT) has transformed the flex circuit manufacturing process.
  3. How FPCs are opening up opportunities for applications in the aerospace, medical and automotive sectors.
  4. How to specify an FPC in six easy steps.
11:30 AM - 12:10 PM
Designing Removeable Memory onto a PCB
Richard Warrilow, Technical Author, Nexus

Many applications require removable memory devices. Purposes include in-field data logging and providing products with software updates in scenarios where wired networking is impossible and wireless networking is either also impossible or simply undesirable. When embedding a removable memory device into a product there are a variety of challenges. These include countering potential obsolescence of a selected form factor, addressing security concerns and designing for the physical environment. Bespoke form factor devices and their corresponding PCB-mounted receptacles provide solutions to all these challenges.

DURING THIS SESSION DELEGATES WILL LEARN:
  1. How to assure product longevity through appropriate form factor selection
  2. How to reduce security risks
  3. Which physical environmental considerations should be factored in and why
  4. Which receptacle mounting options are available for bespoke form factor devices
  5. PCB routing issues for high speed memory devices
12:30 PM - 1:10 PM
Avoiding PCB Obsolescence over the Product Lifecycle
Hugh Macdonald, Senior Engineer, Plexus
Nigel Rodger, Digital and Director of Sourcing in EMEA, Plexus

In a time where component constraints and shortages can impact the ability to manufacture a product on time, using supply chain expertise early within the design phase is crucial for success. As a design-through-manufacture partner, Plexus will bring insight into how to service the product across its entire life cycle. It will demonstrate that it is essential to incorporate supply chain expertise into the early design stages in order to create a smooth and efficient transition from design through to end market use.

The delegates will learn about the process of bringing a PCB to life with the product’s supply chain in mind, specifically walking through the following processes:
  1. Design and supply chain collaboration mechanisms and CAD tools
  2. Sectors that rely on long life-cycle PCB designs
  3. What are a component’s life-cycle stages
  4. Supply chain tools for proactively tracking and managing obsolescence
  5. Cost savings of avoiding last time buys of components, PCB life-cycle costs
1:30 PM - 2:10 PM
New Age of communication for Electronics Design & Development
Tony Folan, Senior Field Application Engineer, Altium UK

Stakeholders involved in the electronics design and development process are dispersed across disciplines, geographies and organisations. It’s difficult to keep everyone and everything in sync while design, sourcing and manufacturing information is constantly changing.  Traditional solutions attempt to connect electronics development domains; however, these processes only capture data in individual files, causing disconnected and dispersed knowledge.